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New Materials for The Future
Material physics laboratory
Yoshiharu Kariya
Professor, Department of Materials Science and Engineering
College of Engineering
Materials Science and Engineering in Master's Program
Regional Environment Systems in Doctoral Program
Location: Toyosu Campus
Laboratory Overview
Fracture mechanics of micro size materials and reliability analysis using CAE
Research Outputs You can review research papers in the website below.
Laboratory Research Field
Creep Fatigue Fracture mechanics Micro joining FEM
Recent Research Topics
Mechanical properties of sintered Ag nanoparticles Reliability Analysis of Power Semiconductor Module Fatigue Crack Growth of Resin Materials for Semiconductor Package Evaluation of creep characteristics of materials for semiconductor packages  
Affiliated Conferences
The Japan Society of Mechanical Engineers The Japan Institute of Electronics Packaging The Japan Institute of Metals and Materials    
Related Industries
Applicable Industrial Fields
Instruments and Devices in this Laboratory
Research Seeds